LI-CHIAO HUANG

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 12,170,301
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method forming a semiconductor device structure having an undergrou...
- Patent number 12,148,500
- Issue date Nov 19, 2024
- Etron Technology, Inc.
- Chao-Chun Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Use of brain age model in prediction of brain atrophy
- Patent number 12,133,739
- Issue date Nov 5, 2024
- ACROVIZ USA INC.
- Wen-Yih Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multifunctional single wafer soaking-spinning-cleaning device and w...
- Patent number 12,128,452
- Issue date Oct 29, 2024
- GRAND PROCESS TECHNOLOGY CORPORATION
- Li-tso Huang
- B08 - CLEANING
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection system, detection method, and an update verification meth...
- Patent number 12,086,249
- Issue date Sep 10, 2024
- Industrial Technology Research Institute
- Tzi-Cker Chiueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,062,602
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air channel formation in packaging process
- Patent number 11,984,410
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 11,978,751
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 11,948,954
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of brain age in prediction of cognitive decline of patients wit...
- Patent number 11,883,184
- Issue date Jan 30, 2024
- ACROVIZ USA INC.
- Wen-Yih Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,854,994
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,837,587
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spliced display
- Patent number 11,810,484
- Issue date Nov 7, 2023
- Industrial Technology Research Institute
- Chia-Hsin Chao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,728,249
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with dummy die
- Patent number 11,721,676
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a sensor device and method of manufa...
- Patent number 11,682,654
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air channel formation in packaging process
- Patent number 11,682,637
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Network device, speed test method therefor and speed test system
- Patent number 11,665,077
- Issue date May 30, 2023
- ZYXEL COMMUNICATIONS CORPORATION
- Li-Tsung Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transistor structure with reduced leakage current and adjustable on...
- Patent number 11,616,128
- Issue date Mar 28, 2023
- Etron Technology, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Speech processing method and device thereof
- Patent number 11,587,573
- Issue date Feb 21, 2023
- Acer Incorporated
- Chao-Lun Chen
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATION OF CHEMOTHERAPY EFFECTS ON COGNITIVE FUNCTION...
- Publication number 20250017516
- Publication date Jan 16, 2025
- AcroViz USA Inc.
- Wen-Yih Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355721
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOMESTICATED FOWL HEALTH MONITORING SYSTEM AND METHOD
- Publication number 20240341282
- Publication date Oct 17, 2024
- iCHASE Co., Ltd.
- KUANG-FU CHANG
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
METHOD AND SYSTEM FOR SWITCHING INPUT DEVICE
- Publication number 20240330208
- Publication date Oct 3, 2024
- ASUSTek COMPUTER INC.
- Yi-Chi Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20240312857
- Publication date Sep 19, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL SINGLE WAFER SOAKING-SPINNING-CLEANING DEVICE AND W...
- Publication number 20240293848
- Publication date Sep 5, 2024
- GRAND PROCESS TECHNOLOGY CORPORATION
- Li-tso HUANG
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE COMPENSATION DEVICE
- Publication number 20240258280
- Publication date Aug 1, 2024
- Industrial Technology Research Institute
- Ren-Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20240234460
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION OF RECOMBINANT HUMAN A-THROMBIN IN PLANT-BASED SYSTEM AN...
- Publication number 20240229059
- Publication date Jul 11, 2024
- PROVIEW-MBD BIOTECH CO., LTD.
- Yu-Chia CHANG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SYSTEM AND METHOD FOR TESTING POULTRY RESPONSE
- Publication number 20240206434
- Publication date Jun 27, 2024
- iChase Co., Ltd.
- Kuang-fu Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
USE OF BRAIN AGE MODEL IN PREDICTION OF BRAIN ATROPHY
- Publication number 20240206801
- Publication date Jun 27, 2024
- AcroViz USA Inc.
- Wen-Yih Tseng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178133
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER SPIN CLEANING APPARATUS WITH SOAKING, CLEANING, AND ET...
- Publication number 20240145292
- Publication date May 2, 2024
- GRAND PROCESS TECHNOLOGY CORP.
- Li-tso HUANG
- B08 - CLEANING
Information Patent Application
PRODUCTION OF RECOMBINANT HUMAN A-THROMBIN IN PLANT-BASED SYSTEM AN...
- Publication number 20240132904
- Publication date Apr 25, 2024
- PROVIEW-MBD BIOTECH CO., LTD.
- Yu-Chia CHANG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
TRANSISTOR STRUCTURE
- Publication number 20240105723
- Publication date Mar 28, 2024
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SERIAL BUS DEVICE AND SYSTEM TYPE DETERMINING METHOD THEREOF
- Publication number 20240070109
- Publication date Feb 29, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- PO-CHAO HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072021
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20240047321
- Publication date Feb 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038682
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS

LI-CHIAO HUANG

Person

Patents Grantslast 30 patents

Pixel sensors and methods of forming the same

Stacked semiconductor devices and methods of forming same

Package structure including IPD and method of forming the same

Method forming a semiconductor device structure having an undergrou...

Use of brain age model in prediction of brain atrophy

Multifunctional single wafer soaking-spinning-cleaning device and w...

Chip package structure with bump

Package structure and manufacturing method thereof

Detection system, detection method, and an update verification meth...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of forming same

Air channel formation in packaging process

Pixel sensors and methods of forming the same

Pixel sensors and methods of forming the same

Method of forming device and package structure

Use of brain age in prediction of cognitive decline of patients wit...

Redistribution structure for integrated circuit package and method...

Package structure and manufacturing method thereof

Stacked semiconductor devices and methods of forming same

Spliced display

Chip package structure with molding layer

Alignment mark design for packages

Semiconductor package and method

Package structure with dummy die

Semiconductor structure having a sensor device and method of manufa...

Air channel formation in packaging process

Network device, speed test method therefor and speed test system

Transistor structure with reduced leakage current and adjustable on...

Speech processing method and device thereof

Package structure including IPD and method of forming the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

METHOD FOR EVALUATION OF CHEMOTHERAPY EFFECTS ON COGNITIVE FUNCTION...

Chip Package Structure with Bump

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DOMESTICATED FOWL HEALTH MONITORING SYSTEM AND METHOD

METHOD AND SYSTEM FOR SWITCHING INPUT DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME

MULTIFUNCTIONAL SINGLE WAFER SOAKING-SPINNING-CLEANING DEVICE AND W...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

IMAGE COMPENSATION DEVICE

PIXEL SENSORS AND METHODS OF FORMING THE SAME

PRODUCTION OF RECOMBINANT HUMAN A-THROMBIN IN PLANT-BASED SYSTEM AN...

SYSTEM AND METHOD FOR TESTING POULTRY RESPONSE

USE OF BRAIN AGE MODEL IN PREDICTION OF BRAIN ATROPHY

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SINGLE WAFER SPIN CLEANING APPARATUS WITH SOAKING, CLEANING, AND ET...

PRODUCTION OF RECOMBINANT HUMAN A-THROMBIN IN PLANT-BASED SYSTEM AN...

TRANSISTOR STRUCTURE

UNIVERSAL SERIAL BUS DEVICE AND SYSTEM TYPE DETERMINING METHOD THEREOF

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION