Li-Chih YU

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer printed circuit boards with dimensional stability
- Patent number 9,955,569
- Issue date Apr 24, 2018
- ELITE MATERIAL CO., LTD.
- Ya-Wen Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free resin composition, copper clad laminate using the same...
- Patent number 9,650,512
- Issue date May 16, 2017
- Elite Electronic Material (Kunshan) Co., Ltd
- Rong-Tao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit boards with dimensional stability
- Patent number 9,545,018
- Issue date Jan 10, 2017
- ELITE MATERIAL CO., LTD.
- Ya-Wen Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free resin composition and copper clad laminate and printed...
- Patent number 9,422,412
- Issue date Aug 23, 2016
- ELITE MATERIAL CO., LTD.
- Li-Chih Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper-clad laminate and printed circuit board f...
- Patent number 9,394,438
- Issue date Jul 19, 2016
- ELITE MATERIAL CO., LTD.
- Li-Chih Yu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer printed circuit boards having properties suitable for l...
- Patent number 9,392,683
- Issue date Jul 12, 2016
- ELITE MATERIAL CO., LTD.
- Ming-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free resin composition, copper clad laminate using the same...
- Patent number 9,288,904
- Issue date Mar 15, 2016
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Rong-Tao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free resin composition, and copper clad laminate and printe...
- Patent number 9,279,051
- Issue date Mar 8, 2016
- Elite Material Co., Ltd.
- Li-Chih Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free resin composition
- Patent number 9,238,733
- Issue date Jan 19, 2016
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
- Chang-Yuan Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free resin composition, copper clad laminate using the same...
- Patent number 9,185,801
- Issue date Nov 10, 2015
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD
- Chang-Yuan Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and prepreg, laminate and circuit board thereof
- Patent number 8,404,764
- Issue date Mar 26, 2013
- Elite Material Co., Ltd.
- Li-Chih Yu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY
- Publication number 20170079134
- Publication date Mar 16, 2017
- Elite Material Co., Ltd.
- Ya-Wen KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARDS WITH LOW WARPAGE
- Publication number 20160165714
- Publication date Jun 9, 2016
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Ocean CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY
- Publication number 20160128180
- Publication date May 5, 2016
- Elite Material Co., Ltd.
- Ya-Wen KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARDS SUITABLE FOR LAYER REDUCTION DESIGN
- Publication number 20160120018
- Publication date Apr 28, 2016
- Elite Material Co., Ltd.
- Ming-Chuan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...
- Publication number 20140322541
- Publication date Oct 30, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD F...
- Publication number 20140178696
- Publication date Jun 26, 2014
- ELITE MATERIAL CO., LTD.
- LI-CHIH YU
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...
- Publication number 20140178697
- Publication date Jun 26, 2014
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
- CHANG-YUAN LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...
- Publication number 20140023839
- Publication date Jan 23, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION
- Publication number 20130316155
- Publication date Nov 28, 2013
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
- CHANG-YUAN LI
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, AND COPPER CLAD LAMINATE AND PRINTE...
- Publication number 20130115472
- Publication date May 9, 2013
- ELITE MATERIAL CO., LTD.
- Li-Chih YU
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF
- Publication number 20130075136
- Publication date Mar 28, 2013
- Li-Chih YU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION AND COPPER CLAD LAMINATE AND PRINTED...
- Publication number 20130075138
- Publication date Mar 28, 2013
- Li-Chih YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING METAL BASE LAMINATE
- Publication number 20110274877
- Publication date Nov 10, 2011
- Li-Chih Yu
- B32 - LAYERED PRODUCTS

Person

Patents Grantslast 30 patents

Multi-layer printed circuit boards with dimensional stability

Halogen-free resin composition, copper clad laminate using the same...

Multi-layer printed circuit boards with dimensional stability

Halogen-free resin composition and copper clad laminate and printed...

Resin composition, copper-clad laminate and printed circuit board f...

Multi-layer printed circuit boards having properties suitable for l...

Halogen-free resin composition, copper clad laminate using the same...

Halogen-free resin composition, and copper clad laminate and printe...

Halogen-free resin composition

Halogen-free resin composition, copper clad laminate using the same...

Resin composition and prepreg, laminate and circuit board thereof

Patents Applicationslast 30 patents

MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY

MULTI-LAYER PRINTED CIRCUIT BOARDS WITH LOW WARPAGE

MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY

MULTI-LAYER PRINTED CIRCUIT BOARDS SUITABLE FOR LAYER REDUCTION DESIGN

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...

RESIN COMPOSITION, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD F...

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...

HALOGEN-FREE RESIN COMPOSITION

HALOGEN-FREE RESIN COMPOSITION, AND COPPER CLAD LAMINATE AND PRINTE...

RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF

HALOGEN-FREE RESIN COMPOSITION AND COPPER CLAD LAMINATE AND PRINTED...

METHOD FOR MANUFACTURING METAL BASE LAMINATE