Li-Da Huang

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,622,253
- Issue date Apr 14, 2020
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20220102189
- Publication date Mar 31, 2022
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190378757
- Publication date Dec 12, 2019
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS