Li DENG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical bond-wire stacked chip-scale package with application-spec...
- Patent number 11,538,746
- Issue date Dec 27, 2022
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair-stacked dice device in a system in package, and methods of ma...
- Patent number 10,991,679
- Issue date Apr 27, 2021
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepackaged stair-stacked memory module in a chip scale system in p...
- Patent number 10,930,622
- Issue date Feb 23, 2021
- Intel Corporation
- Zhicheng Ding
- G01 - MEASURING TESTING
Information Patent Grant
Stair-stacked dice device in a system in package, and methods of ma...
- Patent number 10,770,434
- Issue date Sep 8, 2020
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepackaged stair-stacked memory module in a chip scale system in p...
- Patent number 10,727,208
- Issue date Jul 28, 2020
- Intel Corporation
- Zhicheng Ding
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
STAIR-STACKED DICE DEVICE IN A SYSTEM IN PACKAGE, AND METHODS OF MA...
- Publication number 20200402961
- Publication date Dec 24, 2020
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPACKAGED STAIR-STACKED MEMORY MODULE IN A CHIP SCALE SYSTEM IN P...
- Publication number 20200357773
- Publication date Nov 12, 2020
- Intel Corporation
- Zhicheng Ding
- G01 - MEASURING TESTING
Information Patent Application
TECHNIQUES FOR WINDOWED SUBSTRATE INTEGRATED CIRCUIT PACKAGES
- Publication number 20190355700
- Publication date Nov 21, 2019
- Intel Corporation
- Aiping Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL BOND-WIRE STACKED CHIP-SCALE PACKAGE WITH APPLICATION-SPEC...
- Publication number 20190273037
- Publication date Sep 5, 2019
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPACKAGED STAIR-STACKED MEMORY MODULE IN A CHIP SCALE SYSTEM IN P...
- Publication number 20190229092
- Publication date Jul 25, 2019
- Intel Corporation
- Zhicheng Ding
- G01 - MEASURING TESTING
Information Patent Application
STAIR-STACKED DICE DEVICE IN A SYSTEM IN PACKAGE, AND METHODS OF MA...
- Publication number 20190214370
- Publication date Jul 11, 2019
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wearable Personal Computer and Healthcare Devices
- Publication number 20160324487
- Publication date Nov 10, 2016
- Intel Corporation
- Mao GUO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DUAL CONTROL LED DRIVER
- Publication number 20160119988
- Publication date Apr 28, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Chenjie RUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Vertical bond-wire stacked chip-scale package with application-spec...

Stair-stacked dice device in a system in package, and methods of ma...

Prepackaged stair-stacked memory module in a chip scale system in p...

Stair-stacked dice device in a system in package, and methods of ma...

Prepackaged stair-stacked memory module in a chip scale system in p...

Patents Applicationslast 30 patents

STAIR-STACKED DICE DEVICE IN A SYSTEM IN PACKAGE, AND METHODS OF MA...

PREPACKAGED STAIR-STACKED MEMORY MODULE IN A CHIP SCALE SYSTEM IN P...

TECHNIQUES FOR WINDOWED SUBSTRATE INTEGRATED CIRCUIT PACKAGES

VERTICAL BOND-WIRE STACKED CHIP-SCALE PACKAGE WITH APPLICATION-SPEC...

PREPACKAGED STAIR-STACKED MEMORY MODULE IN A CHIP SCALE SYSTEM IN P...

STAIR-STACKED DICE DEVICE IN A SYSTEM IN PACKAGE, AND METHODS OF MA...

Wearable Personal Computer and Healthcare Devices

DUAL CONTROL LED DRIVER