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Li-Han Hung

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  • Taipei City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip packaging structure and chip packaging method
    • Patent number 12,356,742
    • Issue date Jul 8, 2025
    • Tong Hsing Electronic Industries, Ltd.
    • You-Wei Chang
  • Information Patent Grant

    Sensor package structure having solder mask frame
    • Patent number 12,224,359
    • Issue date Feb 11, 2025
    • Tong Hsing Electronic Industries, Ltd.
    • Fu-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure
    • Patent number 12,224,299
    • Issue date Feb 11, 2025
    • Tong Hsing Electronic Industries, Ltd.
    • Chien-Chen Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor lens assembly
    • Patent number 12,189,152
    • Issue date Jan 7, 2025
    • Tong Hsing Electronic Industries, Ltd.
    • Chia-Shuai Chang
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Sensor lens assembly having non-soldering configuration
    • Patent number 12,174,446
    • Issue date Dec 24, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Chia-Shuai Chang
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Sensor package structure
    • Patent number 12,177,996
    • Issue date Dec 24, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Li-Chun Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 12,124,293
    • Issue date Oct 22, 2024
    • ASUSTeK COMPUTER Inc.
    • Yung-Hsiang Chen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Sensor package structure
    • Patent number 12,119,363
    • Issue date Oct 15, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Chien-Chen Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure
    • Patent number 12,113,082
    • Issue date Oct 8, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Ya-Han Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor lens assembly having non-soldering configuration
    • Patent number 12,108,517
    • Issue date Oct 1, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Chia-Shuai Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Sensor package structure
    • Patent number 12,080,659
    • Issue date Sep 3, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Chien-Chen Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hinge structure
    • Patent number 12,001,248
    • Issue date Jun 4, 2024
    • ASUSTeK COMPUTER Inc.
    • Tsung-Ju Chiang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Sensor package structure having ring-shaped solder mask frame
    • Patent number 11,984,516
    • Issue date May 14, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Fu-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure having solder mask frame
    • Patent number 11,967,652
    • Issue date Apr 23, 2024
    • Tong Hsing Electronic Industries, Ltd.
    • Fu-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hinge structure
    • Patent number 11,892,884
    • Issue date Feb 6, 2024
    • ASUSTeK COMPUTER Inc.
    • Tsung-Ju Chiang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Computer device
    • Patent number 11,892,873
    • Issue date Feb 6, 2024
    • ASUSTeK COMPUTER Inc.
    • Yung-Hsiang Chen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Computer device and host module thereof
    • Patent number 11,871,531
    • Issue date Jan 9, 2024
    • ASUSTeK COMPUTER Inc.
    • Yung-Hsiang Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Chip-scale sensor package structure
    • Patent number 11,552,120
    • Issue date Jan 10, 2023
    • KINGPAK TECHNOLOGY INC.
    • Fu-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure
    • Patent number 11,257,964
    • Issue date Feb 22, 2022
    • KINGPAK TECHNOLOGY INC.
    • Fu-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Image sensor package with particle blocking dam
    • Patent number 11,227,885
    • Issue date Jan 18, 2022
    • KINGPAK TECHNOLOGY INC.
    • Li-Chun Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure and sensing module thereof
    • Patent number 11,133,348
    • Issue date Sep 28, 2021
    • KINGPAK TECHNOLOGY INC.
    • Li-Chun Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and method for securing electronic device
    • Patent number 10,990,661
    • Issue date Apr 27, 2021
    • Quanta Computer Inc.
    • Li-Te Hung
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Chip-scale sensor package structure
    • Patent number 10,964,615
    • Issue date Mar 30, 2021
    • KINGPAK TECHNOLOGY INC.
    • Li-Chun Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure
    • Patent number 10,825,851
    • Issue date Nov 3, 2020
    • KINGPAK TECHNOLOGY INC.
    • Sheng Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Computer and automatic protection method thereof
    • Patent number 10,725,852
    • Issue date Jul 28, 2020
    • Quanta Computer Inc.
    • Li-Te Hung
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Optical sensor
    • Patent number 10,700,111
    • Issue date Jun 30, 2020
    • KINGPAK TECHNOLOGY INC.
    • Li-Chun Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic devices and cooling methods adapted to electronic device
    • Patent number 10,627,878
    • Issue date Apr 21, 2020
    • QUANTA COMPUTER INC.
    • Li-Te Hung
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Sensor package structure
    • Patent number 10,600,830
    • Issue date Mar 24, 2020
    • KINGPAK TECHNOLOGY INC.
    • Jian-Ru Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor package structure
    • Patent number 10,411,055
    • Issue date Sep 10, 2019
    • KINGPAK TECHNOLOGY INC.
    • Chun-Hua Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack type sensor package structure
    • Patent number 10,340,250
    • Issue date Jul 2, 2019
    • KINGPAK TECHNOLOGY INC.
    • Jian-Ru Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents