Li Huan Chen

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure of image sensor and method for packaging the same
- Patent number 6,737,720
- Issue date May 18, 2004
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,627,983
- Issue date Sep 30, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,559,539
- Issue date May 6, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of an image sensor and method for manufacturing t...
- Patent number 6,521,881
- Issue date Feb 18, 2003
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an integrated circuit package and method fo...
- Patent number 6,489,572
- Issue date Dec 3, 2002
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked structure of an image sensor and method for manufacturing t...
- Publication number 20020148946
- Publication date Oct 17, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...
- Publication number 20020096360
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensors and method for packaging the same
- Publication number 20020096763
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096729
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096730
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensor and method for packaging the same
- Publication number 20020096758
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096753
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a photosensor and method for packaging the same
- Publication number 20020060287
- Publication date May 23, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS

Li Huan Chen

Person

Patents Grantslast 30 patents

Packaging structure of image sensor and method for packaging the same

Stacked package structure of image sensor

Stacked package structure of image sensor

Stacked structure of an image sensor and method for manufacturing t...

Substrate structure for an integrated circuit package and method fo...

Patents Applicationslast 30 patents

Stacked structure of an image sensor and method for manufacturing t...

SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...

Packaging structure of image sensors and method for packaging the same

Stacked package structure of image sensor

Stacked package structure of image sensor

Packaging structure of image sensor and method for packaging the same

Stacked package structure of image sensor

Structure of a photosensor and method for packaging the same