Li JIANG

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-frequency ceramic packages with modified castellation and meta...
- Patent number 12,040,265
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package seal rings
- Patent number 11,881,460
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package seal rings
- Patent number 11,587,891
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Package Cooling Using Silver Tubes with Getter Absorption...
- Publication number 20240006267
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Built-In Serial Via Chain for Integrity Monitoring of Laminate Subs...
- Publication number 20230352387
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS
- Publication number 20230197642
- Publication date Jun 22, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CERAMIC PACKAGES WITH MODIFIED CASTELLATION AND META...
- Publication number 20230035716
- Publication date Feb 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS
- Publication number 20220384369
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

High-frequency ceramic packages with modified castellation and meta...

Ceramic semiconductor package seal rings

Ceramic semiconductor package seal rings

Patents Applicationslast 30 patents

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

HYBRID CHIP CARRIER PACKAGE

Hermetic Package Cooling Using Silver Tubes with Getter Absorption...

Built-In Serial Via Chain for Integrity Monitoring of Laminate Subs...

CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS

HIGH-FREQUENCY CERAMIC PACKAGES WITH MODIFIED CASTELLATION AND META...

CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS