Li Li

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 12,015,004
- Issue date Jun 18, 2024
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 11,830,842
- Issue date Nov 28, 2023
- NXP USA., Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit modules with front-side interposer terminals and through-mo...
- Patent number 11,581,241
- Issue date Feb 14, 2023
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,800,208
- Issue date Oct 24, 2017
- NXP USA, INC.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,799,580
- Issue date Oct 24, 2017
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,300,254
- Issue date Mar 29, 2016
- Freescale Semiconductor Inc.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Film-assist molded gel-fill cavity package with overflow reservoir
- Patent number 9,040,352
- Issue date May 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Shun Meen Kuo
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Methods and apparatus for RF shielding in vertically-integrated sem...
- Patent number 7,446,017
- Issue date Nov 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Lianjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multilayer printed circuit
- Patent number 7,136,274
- Issue date Nov 14, 2006
- Motorola, Inc.
- Lih-Tyng Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current-carrying electronic component and method of manufacturing same
- Patent number 6,841,736
- Issue date Jan 11, 2005
- Motorola, Inc.
- Lih-Tyng Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and semiconductor component having conductive bump...
- Patent number 6,669,079
- Issue date Dec 30, 2003
- Motorola, Inc.
- Li Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and semiconductor component having conductive bump...
- Patent number 6,451,127
- Issue date Sep 17, 2002
- Motorola, Inc.
- Li Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to control solder reflow furnace with wafer surfa...
- Patent number 6,352,192
- Issue date Mar 5, 2002
- Motorola, Inc.
- Tien-Yu Tom Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing components and component thereof
- Patent number 6,310,403
- Issue date Oct 30, 2001
- Motorola, Inc.
- Chunsheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20230369272
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT AMPLIFIER DEVICES
- Publication number 20230133034
- Publication date May 4, 2023
- NXP USA, Inc.
- Lu LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...
- Publication number 20220208646
- Publication date Jun 30, 2022
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20220130785
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180012815
- Publication date Jan 11, 2018
- NXP USA, Inc.
- LI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20170278763
- Publication date Sep 28, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Li LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20160164471
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20150381117
- Publication date Dec 31, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR
- Publication number 20140001582
- Publication date Jan 2, 2014
- Shun Meen Kuo
- B60 - VEHICLES IN GENERAL
Information Patent Application
STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
- Publication number 20110250721
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS
- Publication number 20080246126
- Publication date Oct 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for RF shielding in vertically-integrated sem...
- Publication number 20070281438
- Publication date Dec 6, 2007
- Lianjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTILAYER PRINTED CIRCUIT
- Publication number 20060092594
- Publication date May 4, 2006
- Lih-Tyng Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Current-carrying electronic component and method of manufacturing same
- Publication number 20040060724
- Publication date Apr 1, 2004
- MOTOROLA, INC.
- Lih-Tyng Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive paste and semiconductor component having conductive bump...
- Publication number 20020195171
- Publication date Dec 26, 2002
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Radio frequency packages containing multilevel power substrates and...

Hybrid device assemblies and method of fabrication

Hybrid device assemblies and method of fabrication

Circuit modules with front-side interposer terminals and through-mo...

Semiconductor device package and methods of manufacture thereof

Radio frequency devices with surface-mountable capacitors for decou...

Semiconductor device package and methods of manufacture thereof

Radio frequency devices with surface-mountable capacitors for decou...

Film-assist molded gel-fill cavity package with overflow reservoir

Methods and apparatus for RF shielding in vertically-integrated sem...

Embedded multilayer printed circuit

Current-carrying electronic component and method of manufacturing same

Conductive paste and semiconductor component having conductive bump...

Conductive paste and semiconductor component having conductive bump...

System and method to control solder reflow furnace with wafer surfa...

Method of manufacturing components and component thereof

Patents Applicationslast 30 patents

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

SURFACE-MOUNT AMPLIFIER DEVICES

CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Methods and apparatus for RF shielding in vertically-integrated sem...

EMBEDDED MULTILAYER PRINTED CIRCUIT

Current-carrying electronic component and method of manufacturing same

Conductive paste and semiconductor component having conductive bump...