Li-Ling Liao

Person

Changhua County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including intra-die structural reinforcement str...
- Patent number 12,040,267
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of package containing chip structure...
- Patent number 11,978,722
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,728,284
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 11,705,406
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including intra-die structural reinforcement str...
- Patent number 11,610,835
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent diagnosis system for power module and method thereof
- Patent number 10,288,696
- Issue date May 14, 2019
- Industrial Technology Research Institute
- Chih-Chung Chiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermoelectric apparatus and method of fabricating the same
- Patent number 8,664,509
- Issue date Mar 4, 2014
- Industrial Technology Research Institute
- Chun-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembly apparatus, device self-assembling method, and method...
- Patent number 8,609,454
- Issue date Dec 17, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240387405
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...
- Publication number 20240321717
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS
- Publication number 20240250069
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...
- Publication number 20240071949
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER STRUCTURE WITH BEVELED SIDEWALL FOR FOOTPRINT REDUCTION A...
- Publication number 20230402404
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20230395443
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT I...
- Publication number 20230395515
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20230395520
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same
- Publication number 20230395492
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR F...
- Publication number 20230386988
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20230378039
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER BLOCK STRUCTURES FOR C4 BONDING AND METHODS OF USING THE SAME
- Publication number 20230352381
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20230343725
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230326879
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBUMP UNDERFILL FILLET REMOVAL IN SEMICONDUCTOR DIE PACKAGING A...
- Publication number 20230326898
- Publication date Oct 12, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS...
- Publication number 20230317671
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...
- Publication number 20230223328
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230063251
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE CONTAINING CHIP STRUCTURE...
- Publication number 20230069311
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230066598
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STIFFENER RING HAVING SLANT SIDEWALL
- Publication number 20230063295
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230017688
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406729
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...
- Publication number 20220139816
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DIAGNOSIS SYSTEM FOR POWER MODULE AND METHOD THEREOF
- Publication number 20180136287
- Publication date May 17, 2018
- Industrial Technology Research Institute
- Chih-Chung CHIU
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
- Publication number 20180040798
- Publication date Feb 8, 2018
- Industrial Technology Research Institute
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
- Publication number 20160163950
- Publication date Jun 9, 2016
- Industrial Technology Research Institute
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY APPARATUS, DEVICE SELF-ASSEMBLING METHOD, AND METHOD...
- Publication number 20130302935
- Publication date Nov 14, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS

Li-Ling Liao

Person

Patents Grantslast 30 patents

Package structure and method for forming the same

Chip package structure

Organic interposer including intra-die structural reinforcement str...

Package structure and method for forming the same

Structure and formation method of package containing chip structure...

Chip package structure and method for forming the same

Package structure and method for forming the same

Organic interposer including intra-die structural reinforcement str...

Intelligent diagnosis system for power module and method thereof

Thermoelectric apparatus and method of fabricating the same

Self-assembly apparatus, device self-assembling method, and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE

ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS

TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...

STIFFENER STRUCTURE WITH BEVELED SIDEWALL FOR FOOTPRINT REDUCTION A...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT I...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same

SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR F...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

BUFFER BLOCK STRUCTURES FOR C4 BONDING AND METHODS OF USING THE SAME

CHIP PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MICROBUMP UNDERFILL FILLET REMOVAL IN SEMICONDUCTOR DIE PACKAGING A...

SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS...

ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE CONTAINING CHIP STRUCTURE...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE WITH STIFFENER RING HAVING SLANT SIDEWALL

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...

INTELLIGENT DIAGNOSIS SYSTEM FOR POWER MODULE AND METHOD THEREOF

STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF

STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF

SELF-ASSEMBLY APPARATUS, DEVICE SELF-ASSEMBLING METHOD, AND METHOD...