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Patents Grants
last 30 patents
Information
Patent Grant
Rolling mill
Patent number
10,875,064
Issue date
Dec 29, 2020
Baoshan Iron & Steel Co., Ltd.
Zhengyi Jiang
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Method and device for communication in D2D UE of TDD system
Patent number
10,064,176
Issue date
Aug 28, 2018
Shanghai Langbo Communication Technology Company Limited
Li Ma
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Additive C capable of changing microvia-filling method by TSV coppe...
Patent number
9,915,005
Issue date
Mar 13, 2018
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Additive for reducing voids after annealing of copper plating with...
Patent number
9,856,572
Issue date
Jan 2, 2018
Su Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
HEAT EXCHANGER FOR COOLING BATTERY
Publication number
20190237827
Publication date
Aug 1, 2019
Zengfang GE
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
ROLLING MILL
Publication number
20180193889
Publication date
Jul 12, 2018
Baoshan Iron & Steel Co., Ltd
Zhengyi JIANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HEAT EXCHANGER FOR BATTERY COOLING
Publication number
20180006344
Publication date
Jan 4, 2018
NEXTEV LIMITED
Zengfang GE
B60 - VEHICLES IN GENERAL
Information
Patent Application
A METHOD FOR MICROVIA FILLING BY COPPER ELECTROPLATING WITH TSV TEC...
Publication number
20160190007
Publication date
Jun 30, 2016
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ADDITIVE C CAPABLE OF CHANGING MICROVIA-FILLING METHOD BY TSV COPPE...
Publication number
20160168737
Publication date
Jun 16, 2016
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Additive for Reducing Voids after Annealing of Copper Plating with...
Publication number
20160168738
Publication date
Jun 16, 2016
SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
Su WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD AND DEVICE FOR COMMUNICATION IN D2D UE OF TDD SYSTEM
Publication number
20160119921
Publication date
Apr 28, 2016
SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
Li Ma
H04 - ELECTRIC COMMUNICATION TECHNIQUE