Li Ping Li

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a multi-layer low-K dual damascene
- Patent number 7,129,164
- Issue date Oct 31, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric crossover structure of two lines for RF integrated circuits
- Patent number 6,825,749
- Issue date Nov 30, 2004
- National Applied Research Laboratories National Chip Implementation Center
- Tser Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING CHIP PACKAGE ST...
- Publication number 20150347806
- Publication date Dec 3, 2015
- CHIPMOS TECHNOLOGIES INC.
- Li-Chun Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for forming a multi-layer low-K dual damascene
- Publication number 20060084279
- Publication date Apr 20, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS