Li-Sheng WENG

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 11,605,594
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die interconnect
- Patent number 11,594,491
- Issue date Feb 28, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repurposed seed layer for high frequency noise control and electros...
- Patent number 11,380,613
- Issue date Jul 5, 2022
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having electromagnetic interference shielding
- Patent number 11,189,574
- Issue date Nov 30, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate having a via wall configured as a sh...
- Patent number 11,139,224
- Issue date Oct 5, 2021
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,910,314
- Issue date Feb 2, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,658,198
- Issue date May 19, 2020
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,510,667
- Issue date Dec 17, 2019
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,244,632
- Issue date Mar 26, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package including floating package stiffener
- Patent number 9,900,976
- Issue date Feb 20, 2018
- Intel Corporation
- Chung-Hao Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE
- Publication number 20240178087
- Publication date May 30, 2024
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
- Publication number 20240071958
- Publication date Feb 29, 2024
- Xilinx, Inc.
- Hong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES
- Publication number 20240055359
- Publication date Feb 15, 2024
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED LOOP AND VOID STRUCTURE INTEGRATED IN A REDISTRIBUTION LAYE...
- Publication number 20230335510
- Publication date Oct 19, 2023
- Xilinx, Inc.
- Po-Wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED CURRENT CONTROL
- Publication number 20230326842
- Publication date Oct 12, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
- Publication number 20230253380
- Publication date Aug 10, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTERCONNECT
- Publication number 20220352075
- Publication date Nov 3, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES
- Publication number 20220320026
- Publication date Oct 6, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMP...
- Publication number 20220199547
- Publication date Jun 23, 2022
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...
- Publication number 20220149005
- Publication date May 12, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPURPOSED SEED LAYER FOR HIGH FREQUENCY NOISE CONTROL AND ELECTROS...
- Publication number 20210375742
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...
- Publication number 20210296246
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...
- Publication number 20210175152
- Publication date Jun 10, 2021
- QUALCOMM Incorporated
- Chaoqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20210118809
- Publication date Apr 22, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE
- Publication number 20200118930
- Publication date Apr 16, 2020
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20190181017
- Publication date Jun 13, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20180255640
- Publication date Sep 6, 2018
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE
- Publication number 20180174972
- Publication date Jun 21, 2018
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS

Li-Sheng WENG

Person

Patents Grantslast 30 patents

Chip package with near-die integrated passive device

Package comprising integrated devices coupled through a metallizati...

Integrated device comprising interconnect structures having an inne...

Package comprising a substrate and a high-density interconnect inte...

Multi-die interconnect

Repurposed seed layer for high frequency noise control and electros...

Microelectronic package having electromagnetic interference shielding

Package comprising a substrate having a via wall configured as a sh...

Conductive coating for a microelectronics package

Solder resist layer structures for terminating de-featured componen...

Conductive coating for a microelectronics package

Solder resist layer structures for terminating de-featured componen...

Integrated circuit package including floating package stiffener

Patents Applicationslast 30 patents

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE

CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES

COUPLED LOOP AND VOID STRUCTURE INTEGRATED IN A REDISTRIBUTION LAYE...

CHIP PACKAGE WITH INTEGRATED CURRENT CONTROL

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

MULTI-DIE INTERCONNECT

PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES

FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMP...

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...

REPURPOSED SEED LAYER FOR HIGH FREQUENCY NOISE CONTROL AND ELECTROS...

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...

PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING

CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE

SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...

SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...

CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE

On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...