TREA

Li SHENGHUA

Follow

Person

  • Niigata, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Catalyst solution for electroless plating
    • Patent number 10,543,482
    • Issue date Jan 28, 2020
    • Rohm and Haas Electronic Materials LLC
    • Hiroki Okada
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Tin or tin alloy plating liquid
    • Patent number 9,926,637
    • Issue date Mar 27, 2018
    • Rohm and Haas Electronic Materials LLC
    • Hiroki Okada
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Tin alloy plating solution
    • Patent number 9,228,269
    • Issue date Jan 5, 2016
    • Rohm and Haas Electronic Materials LLC
    • Hiroki Okada
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR PLATING ON SURFACE OF NON-CONDUCTIVE SUBSTRATE
    • Publication number 20180030600
    • Publication date Feb 1, 2018
    • Rohm and Haas Electronic Materials L.L.C.
    • Hiroki Okada
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TIN OR TIN ALLOY PLATING LIQUID
    • Publication number 20160102413
    • Publication date Apr 14, 2016
    • Rohm and Haas Electronic Materials L.L.C.
    • Hiroki OKADA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CATALYST SOLUTION FOR ELECTROLESS PLATING
    • Publication number 20150118406
    • Publication date Apr 30, 2015
    • Rohm and Haas Electronic Materials L.L.C.
    • Hiroki OKADA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TIN ALLOY PLATING SOLUTION
    • Publication number 20140251818
    • Publication date Sep 11, 2014
    • Hiroki OKADA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    TIN OR TIN ALLOY PLATING LIQUID
    • Publication number 20140183050
    • Publication date Jul 3, 2014
    • Hiroki OKADA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR