Li-Wei Feng

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Storage node contact structure of a memory device
- Patent number 11,877,433
- Issue date Jan 16, 2024
- United Microelectronics Corp.
- Pin-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with capacitor landing pad and method of ma...
- Patent number 11,765,881
- Issue date Sep 19, 2023
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bit line comprising a plurality of pins...
- Patent number 11,744,062
- Issue date Aug 29, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,737,257
- Issue date Aug 22, 2023
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device comprises a bit line...
- Patent number 11,600,622
- Issue date Mar 7, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with capacitor landing pad and method of ma...
- Patent number 11,563,012
- Issue date Jan 24, 2023
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having capped air gaps betwe...
- Patent number 11,508,614
- Issue date Nov 22, 2022
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a second active region disposed...
- Patent number 11,424,247
- Issue date Aug 23, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,387,148
- Issue date Jul 12, 2022
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,380,754
- Issue date Jul 5, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,271,000
- Issue date Mar 8, 2022
- United Microelectronics Corp.
- Bo-Ruei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,233,057
- Issue date Jan 25, 2022
- United Microelectronics Corp.
- Po-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating structure and method of forming the same
- Patent number 11,121,136
- Issue date Sep 14, 2021
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor memory device
- Patent number 11,069,689
- Issue date Jul 20, 2021
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with capacitor landing pad and method of ma...
- Patent number 11,049,863
- Issue date Jun 29, 2021
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a semiconductor structure
- Patent number 11,018,006
- Issue date May 25, 2021
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,978,457
- Issue date Apr 13, 2021
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,861,855
- Issue date Dec 8, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capped air caps between buried bit line...
- Patent number 10,854,676
- Issue date Dec 1, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,763,260
- Issue date Sep 1, 2020
- United Microelectronics Corp.
- Chien-Ting Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage node contact structure of a memory device and manufacturing...
- Patent number 10,756,090
- Issue date Aug 25, 2020
- United Microelectronics Corp.
- Pin-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,692,777
- Issue date Jun 23, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a layout pattern
- Patent number 10,670,958
- Issue date Jun 2, 2020
- United Microelectronics Corp.
- Ying-Chiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor memory device
- Patent number 10,672,864
- Issue date Jun 2, 2020
- United Microelectronics Corp.
- Tzu-Chin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including gate structure
- Patent number 10,665,594
- Issue date May 26, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,658,365
- Issue date May 19, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal gates
- Patent number 10,643,997
- Issue date May 5, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor memory device
- Patent number 10,600,790
- Issue date Mar 24, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,553,591
- Issue date Feb 4, 2020
- United Microelectronics Corp.
- Ying-Chiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for avoiding short circuit between adjacent st...
- Patent number 10,546,861
- Issue date Jan 28, 2020
- United Microelectronics Corp.
- Tzu-Tsen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MA...
- Publication number 20230097175
- Publication date Mar 30, 2023
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220406651
- Publication date Dec 22, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20220359528
- Publication date Nov 10, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20220359531
- Publication date Nov 10, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220059647
- Publication date Feb 24, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MA...
- Publication number 20210272962
- Publication date Sep 2, 2021
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193668
- Publication date Jun 24, 2021
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20210043684
- Publication date Feb 11, 2021
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE NODE CONTACT STRUCTURE OF A MEMORY DEVICE
- Publication number 20200350317
- Publication date Nov 5, 2020
- UNITED MICROELECTRONICS CORP.
- Pin-Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200273758
- Publication date Aug 27, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200235101
- Publication date Jul 23, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE
- Publication number 20200185391
- Publication date Jun 11, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200111795
- Publication date Apr 9, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200111794
- Publication date Apr 9, 2020
- UNITED MICROELECTRONICS CORP.
- Bo-Ruei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200105763
- Publication date Apr 2, 2020
- UNITED MICROELECTRONICS CORP.
- Po-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200035782
- Publication date Jan 30, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING A SEMICONDUCTOR STRUCTURE
- Publication number 20200035492
- Publication date Jan 30, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200035685
- Publication date Jan 30, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING A SEMICONDUCTOR STRUCTURE
- Publication number 20190341252
- Publication date Nov 7, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190341385
- Publication date Nov 7, 2019
- UNITED MICROELECTRONICS CORP.
- Tzu-Tsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190333913
- Publication date Oct 31, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20190296019
- Publication date Sep 26, 2019
- UNITED MICROELECTRONICS CORP.
- Po-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190206982
- Publication date Jul 4, 2019
- UNITED MICROELECTRONICS CORP.
- Tzu-Chin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190206874
- Publication date Jul 4, 2019
- UNITED MICROELECTRONICS CORP.
- Ying-Chiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20190157445
- Publication date May 23, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20190115352
- Publication date Apr 18, 2019
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190081048
- Publication date Mar 14, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190081047
- Publication date Mar 14, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20190067292
- Publication date Feb 28, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190019805
- Publication date Jan 17, 2019
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS

Li-Wei Feng

Person

Patents Grantslast 30 patents

Storage node contact structure of a memory device

Semiconductor structure with capacitor landing pad and method of ma...

Semiconductor device having bit line comprising a plurality of pins...

Semiconductor device and manufacturing method thereof

Method of forming semiconductor memory device comprises a bit line...

Semiconductor structure with capacitor landing pad and method of ma...

Method of forming semiconductor device having capped air gaps betwe...

Semiconductor memory device having a second active region disposed...

Semiconductor device

Manufacturing method of semiconductor device and semiconductor device

Method for fabricating semiconductor device

Semiconductor structure and fabrication method thereof

Insulating structure and method of forming the same

Manufacturing method of semiconductor memory device

Semiconductor structure with capacitor landing pad and method of ma...

Method for patterning a semiconductor structure

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device having capped air caps between buried bit line...

Semiconductor device and method of manufacturing a semiconductor de...

Storage node contact structure of a memory device and manufacturing...

Semiconductor device

Method for forming a layout pattern

Manufacturing method of semiconductor memory device

Semiconductor memory device including gate structure

Semiconductor device and method of manufacturing the same

Semiconductor device with metal gates

Manufacturing method of semiconductor memory device

Semiconductor memory device

Semiconductor device for avoiding short circuit between adjacent st...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR DEVICE

STORAGE NODE CONTACT STRUCTURE OF A MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE

METHOD FOR PATTERNING A SEMICONDUCTOR STRUCTURE

INSULATING STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR PATTERNING A SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INSULATING STRUCTURE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE