TREA

Li Yan SIOW

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for low temperature bonding of wafers
    • Patent number 10,134,607
    • Issue date Nov 20, 2018
    • Agency for Science, Technology and Research
    • Vivek Chidambaram
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEAL RING FOR AL-Ge BONDING
    • Publication number 20190031502
    • Publication date Jan 31, 2019
    • Agency for Science, Technology and Research
    • Vivek CHIDAMBARAM
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    A Method For Low Temperature Bonding Of Wafers
    • Publication number 20170178929
    • Publication date Jun 22, 2017
    • Agency for Science, Technology and Research
    • Vivek CHIDAMBARAM
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR