Liana Foster

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,366,934
- Issue date Jul 30, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,153,221
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assembly
- Patent number 9,601,374
- Issue date Mar 21, 2017
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Face Down Dual Sided Chip Scale Memory Package
- Publication number 20190088565
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Face Down Dual Sided Chip Scale Memory Package
- Publication number 20180358275
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLY
- Publication number 20160284675
- Publication date Sep 29, 2016
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS