Liane Martinez

Person

New Market, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Automatic redistribution layer via generation
- Patent number 11,960,813
- Issue date Apr 16, 2024
- Advanced Micro Devices, Inc.
- Rajagopalan Venkatramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip package with undermount passive devices
- Patent number 9,607,935
- Issue date Mar 28, 2017
- ATI Technologies ULC
- Liane Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management circuit board for stacked semiconductor chip device
- Patent number 9,209,106
- Issue date Dec 8, 2015
- ATI Technologies ULC
- Xiao Ling Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Face-to-face (F2F) hybrid structure for an integrated circuit
- Patent number 8,637,983
- Issue date Jan 28, 2014
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board component shim structure
- Patent number 8,564,122
- Issue date Oct 22, 2013
- Advanced Micro Devices, Inc.
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrates having asymmetric buildup layers
- Patent number 8,298,945
- Issue date Oct 30, 2012
- ATI Technologies ULC
- Andrew Leung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor chip substrate with multi-capacitor footprint
- Patent number 8,012,874
- Issue date Sep 6, 2011
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-site probe
- Patent number 7,847,568
- Issue date Dec 7, 2010
- Advanced Micro Devices, Inc.
- Andrew Gangoso
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATED REDISTRIBUTION LAYER POWER CONNECTIONS
- Publication number 20230032595
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- Rajagopalan Venkatramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTOMATIC REDISTRIBUTION LAYER VIA GENERATION
- Publication number 20230036608
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- Rajagopalan Venkatramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP D...
- Publication number 20130343000
- Publication date Dec 26, 2013
- Xiao Ling Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK INTERPOSER
- Publication number 20130147026
- Publication date Jun 13, 2013
- ATI Technologies ULC
- Roden R. TOPACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD COMPONENT SHIM STRUCTURE
- Publication number 20130147012
- Publication date Jun 13, 2013
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS
- Publication number 20110225813
- Publication date Sep 22, 2011
- ATI Technologies ULC
- Andrew Leung
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS
- Publication number 20110024898
- Publication date Feb 3, 2011
- ATI Technologies ULC
- Andrew Leung
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Chip Package with Undermount Passive Devices
- Publication number 20100265682
- Publication date Oct 21, 2010
- Liane Martinez
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT
- Publication number 20100155938
- Publication date Jun 24, 2010
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Hybrid Semiconductor Chip Package
- Publication number 20100102457
- Publication date Apr 29, 2010
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Substrate with Multi-Capacitor Footprint
- Publication number 20090152690
- Publication date Jun 18, 2009
- Yue Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-Site Probe
- Publication number 20090045827
- Publication date Feb 19, 2009
- Andrew Gangoso
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD
- Publication number 20080245555
- Publication date Oct 9, 2008
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Liane Martinez

Person

Patents Grantslast 30 patents

Automatic redistribution layer via generation

Semiconductor chip package with undermount passive devices

Thermal management circuit board for stacked semiconductor chip device

Face-to-face (F2F) hybrid structure for an integrated circuit

Circuit board component shim structure

Method of manufacturing substrates having asymmetric buildup layers

Semiconductor chip substrate with multi-capacitor footprint

Multi-site probe

Patents Applicationslast 30 patents

AUTOMATED REDISTRIBUTION LAYER POWER CONNECTIONS

AUTOMATIC REDISTRIBUTION LAYER VIA GENERATION

THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP D...

HEATSINK INTERPOSER

CIRCUIT BOARD COMPONENT SHIM STRUCTURE

METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS

METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS

Semiconductor Chip Package with Undermount Passive Devices

FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT

Hybrid Semiconductor Chip Package

Semiconductor Chip Substrate with Multi-Capacitor Footprint

Multi-Site Probe

CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD