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Patents Grants
last 30 patents
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
9,324,676
Issue date
Apr 26, 2016
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,900,923
Issue date
Dec 2, 2014
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,399,971
Issue date
Mar 19, 2013
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
7,741,150
Issue date
Jun 22, 2010
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for molding semiconductor components
Patent number
6,652,799
Issue date
Nov 25, 2003
Micron Technology, Inc.
Toh Kok Seng
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of encapsulating thin semiconductor chip-scale packages
Patent number
6,544,816
Issue date
Apr 8, 2003
Texas Instruments Incorporated
Tiang Hock Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for molding semiconductor components
Patent number
6,439,869
Issue date
Aug 27, 2002
Micron Technology, Inc.
Toh Kok Seng
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of encapsulating thin semiconductor chip-scale packages
Patent number
6,331,737
Issue date
Dec 18, 2001
Texas Instruments Incorporated
Tiang Hock Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20150130035
Publication date
May 14, 2015
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20130217182
Publication date
Aug 22, 2013
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20100237510
Publication date
Sep 23, 2010
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR WORKPIECES
Publication number
20080172869
Publication date
Jul 24, 2008
Micron Technology, Inc.
Kia Heng Puah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20080128900
Publication date
Jun 5, 2008
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for molding semiconductor components
Publication number
20020056942
Publication date
May 16, 2002
Toh Kok Seng
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL