Liang-Chun CHEN

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,094,649
- Issue date Aug 17, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of forming package body
- Patent number 10,943,800
- Issue date Mar 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210225781
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF FORMING PACKAGE BODY
- Publication number 20180301361
- Publication date Oct 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS