Liang Ding

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
In-packaged multi-channel light engine on single substrate
- Patent number 11,777,631
- Issue date Oct 3, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Method for co-packaging light engine chiplets on switch substrate
- Patent number 11,677,478
- Issue date Jun 13, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,612,079
- Issue date Mar 21, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
In-packaged multi-channel light engine on single substrate
- Patent number 11,218,242
- Issue date Jan 4, 2022
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Co-packaged light engine chiplets on switch substrate
- Patent number 11,178,473
- Issue date Nov 16, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Method for co-packaging light engine chiplets on switch substrate
- Patent number 11,165,509
- Issue date Nov 2, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. Nagarajan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,109,515
- Issue date Aug 31, 2021
- Inphi Corporation
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact optical module integrated for communicating cryptocurrency...
- Patent number 10,924,269
- Issue date Feb 16, 2021
- INPHI CORPORATION
- Liang Ding
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical transceiver by FOWLP and DOP multichip integration
- Patent number 10,120,150
- Issue date Nov 6, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Vertical integration of hybrid waveguide with controlled interlayer...
- Patent number 10,107,961
- Issue date Oct 23, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Optical transceiver by FOWLP and DoP multichip integration
- Patent number 10,001,611
- Issue date Jun 19, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,921,379
- Issue date Mar 20, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Vertical integration of hybrid waveguide with controlled interlayer...
- Patent number 9,885,831
- Issue date Feb 6, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Vertical integration of hybrid waveguide with controlled interlayer...
- Patent number 9,671,557
- Issue date Jun 6, 2017
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,651,751
- Issue date May 16, 2017
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Silicon-based electro-optic device
- Patent number 8,532,440
- Issue date Sep 10, 2013
- NEC Corporation
- Jun Ushida
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20230225090
- Publication date Jul 13, 2023
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE
- Publication number 20220123852
- Publication date Apr 21, 2022
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE
- Publication number 20210385560
- Publication date Dec 9, 2021
- INPHI CORPORATION
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR CO-PACKAGING LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE
- Publication number 20210384989
- Publication date Dec 9, 2021
- Marvell Asia Pte, Ltd.
- Radhakrashnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE
- Publication number 20210385000
- Publication date Dec 9, 2021
- INPHI CORPORATION
- Radhakrishnan L. NAGARAJAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20210385975
- Publication date Dec 9, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION
- Publication number 20180275359
- Publication date Sep 27, 2018
- INPHI CORPORATION
- Liang DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTEGRATION OF HYBRID WAVEGUIDE WITH CONTROLLED INTERLAYER...
- Publication number 20180136395
- Publication date May 17, 2018
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
COMPACT OPTICAL TRANSCEIVER BY HYBRID MULTICHIP INTEGRATION
- Publication number 20170261708
- Publication date Sep 14, 2017
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION
- Publication number 20170254968
- Publication date Sep 7, 2017
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
VERTICAL INTEGRATION OF HYBRID WAVEGUIDE WITH CONTROLLED INTERLAYER...
- Publication number 20170254953
- Publication date Sep 7, 2017
- INPHI CORPORATION
- Liang DING
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20120043527
- Publication date Feb 23, 2012
- Agency For Science, Technology and Research
- Liang Ding
- B82 - NANO-TECHNOLOGY
Information Patent Application
SILICON-BASED ELECTRO-OPTIC DEVICE
- Publication number 20110211786
- Publication date Sep 1, 2011
- NEC Corporation
- Jun USHIDA
- G02 - OPTICS

Person

Patents Grantslast 30 patents

In-packaged multi-channel light engine on single substrate

Method for co-packaging light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

In-packaged multi-channel light engine on single substrate

Co-packaged light engine chiplets on switch substrate

Method for co-packaging light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

Compact optical module integrated for communicating cryptocurrency...

Optical transceiver by FOWLP and DOP multichip integration

Vertical integration of hybrid waveguide with controlled interlayer...

Optical transceiver by FOWLP and DoP multichip integration

Compact optical transceiver by hybrid multichip integration

Vertical integration of hybrid waveguide with controlled interlayer...

Vertical integration of hybrid waveguide with controlled interlayer...

Compact optical transceiver by hybrid multichip integration

Silicon-based electro-optic device

Patents Applicationslast 30 patents

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE

CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE

METHOD FOR CO-PACKAGING LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE

IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

VERTICAL INTEGRATION OF HYBRID WAVEGUIDE WITH CONTROLLED INTERLAYER...

COMPACT OPTICAL TRANSCEIVER BY HYBRID MULTICHIP INTEGRATION

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

VERTICAL INTEGRATION OF HYBRID WAVEGUIDE WITH CONTROLLED INTERLAYER...

LIGHT EMITTING DEVICE

SILICON-BASED ELECTRO-OPTIC DEVICE