Liang HE

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...
- Publication number 20240213164
- Publication date Jun 27, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
- Publication number 20240186263
- Publication date Jun 6, 2024
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE P...
- Publication number 20230197660
- Publication date Jun 22, 2023
- Intel Corporation
- Yue DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...
- Publication number 20230197543
- Publication date Jun 22, 2023
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...
- Publication number 20230091379
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...

STRUCTURE AND PROCESS FOR WARPAGE REDUCTION

SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE P...

MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...

DAM SURROUNDING A DIE ON A SUBSTRATE

FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...