Liang-Hsuan PENG

Person

Taipei, TW

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR GAP FILL AND PLANARIZATION
- Publication number 20250079304
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Liang-Shiuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE
- Publication number 20250056820
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND METHOD FOR MANUFA...
- Publication number 20240170223
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY
- Publication number 20240030081
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING RELIABLE LINE PATTERN DESIGNS AND ME...
- Publication number 20240014037
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230411279
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS

Liang-Hsuan PENG

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR GAP FILL AND PLANARIZATION

METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

CAPACITOR STRUCTURE, SEMICONDUCTOR STRUCTURE, AND METHOD FOR MANUFA...

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

SEMICONDUCTOR ASSEMBLY

SEMICONDUCTOR STRUCTURE HAVING RELIABLE LINE PATTERN DESIGNS AND ME...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME