Liang-Jie Lin

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing copper foil with rough surface in plating...
- Patent number 11,008,665
- Issue date May 18, 2021
- National Chung-Hsing University
- Wei-Ping Dow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing flexible conductive substrate with high transm...
- Patent number 10,465,056
- Issue date Nov 5, 2019
- National Chung-Hsing University
- Wei-Ping Dow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING COPPER FOIL WITH ROUGH SURFACE IN PLATING...
- Publication number 20190376198
- Publication date Dec 12, 2019
- National Chung Hsing University
- Wei-Ping Dow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING FLEXIBLE CONDUCTIVE SUBSTRATE WITH HIGH TRANSM...
- Publication number 20180340050
- Publication date Nov 29, 2018
- National Chung Hsing University
- Wei-Ping Dow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...