Liang MENG

Follow

Person

Guangdong, CN

People

Patents Applicationslast 30 patents

Information Patent Application
BGA PACKAGE MODULE DESOLDERING APPARATUS AND METHOD
- Publication number 20090166397
- Publication date Jul 2, 2009
- Universal Scientific Industrial Co., Ltd.
- Liang MENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR