Liang WAN

Person

Chengdu, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,901,271
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor package with stacked passive components
- Patent number 11,587,899
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,545,420
- Issue date Jan 3, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,362,047
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20230207509
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT
- Publication number 20230145761
- Publication date May 11, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20220285293
- Publication date Sep 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20220209391
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20220181241
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20220037280
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20210327829
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES FOR BROADBAND RF SIGNAL CHAIN
- Publication number 20200411418
- Publication date Dec 31, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT
- Publication number 20200258825
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated system-in-package with radiation shielding

High current packages with reduced solder layer count

Plated metal layer in power packages

Multi-layer semiconductor package with stacked passive components

High current packages with reduced solder layer count

Integrated system-in-package with radiation shielding

Patents Applicationslast 30 patents

PLATED METAL LAYER IN POWER PACKAGES

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

PLATED METAL LAYER IN POWER PACKAGES

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

SEMICONDUCTOR PACKAGE STRUCTURES FOR BROADBAND RF SIGNAL CHAIN

HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT