Liang William Zhang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for inspecting embedded features
- Patent number 12,216,301
- Issue date Feb 4, 2025
- Intel Corporation
- Jacob Chesna
- G01 - MEASURING TESTING
Information Patent Grant
Device, method and system for optical communication with a waveguid...
- Patent number 12,164,147
- Issue date Dec 10, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Non-destructive gap metrology
- Patent number 11,913,772
- Issue date Feb 27, 2024
- Intel Corporation
- Jianyong Mo
- G01 - MEASURING TESTING
Information Patent Grant
Method to achieve tilted patterning with a through resist thickness...
- Patent number 11,644,757
- Issue date May 9, 2023
- Intel Corporation
- Changhua Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for semiconductor package inspection
- Patent number 10,794,840
- Issue date Oct 6, 2020
- Intel Corporation
- Liang Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
2D metrology technique for solder paste inspection
- Patent number 10,572,992
- Issue date Feb 25, 2020
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflectivity analysis to determine material on a surface
- Patent number 10,401,286
- Issue date Sep 3, 2019
- Intel Corporation
- Jianyong Mo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection of microelectronic devices using near-infrared light
- Patent number 10,066,927
- Issue date Sep 4, 2018
- Intel Corporation
- Liang W. Zhang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Inspection of microelectronic devices using near-infrared light
- Patent number 9,488,595
- Issue date Nov 8, 2016
- Intel Corporation
- Liang W. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment inspection
- Patent number 8,399,264
- Issue date Mar 19, 2013
- Intel Corporation
- Zhihua Zou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR BEAM EXPANSION IN MONOLITHIC GLASS SUBSTRATES
- Publication number 20250004203
- Publication date Jan 2, 2025
- Intel Corporation
- Jianyong Mo
- G02 - OPTICS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION TOOL AND INSPECTION METHOD
- Publication number 20230358690
- Publication date Nov 9, 2023
- Intel Corporation
- Jianyong MO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUSES AND METHODS FOR INSPECTING EMBEDDED FEATURES
- Publication number 20230314682
- Publication date Oct 5, 2023
- Intel Corporation
- Jacob CHESNA
- G02 - OPTICS
Information Patent Application
NON-DESTRUCTIVE GAP METROLOGY
- Publication number 20230296371
- Publication date Sep 21, 2023
- Intel Corporation
- Jianyong MO
- G01 - MEASURING TESTING
Information Patent Application
METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...
- Publication number 20230236517
- Publication date Jul 27, 2023
- Intel Corporation
- Changhua LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...
- Publication number 20220413214
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...
- Publication number 20220413210
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...
- Publication number 20210191282
- Publication date Jun 24, 2021
- Intel Corporation
- Changhua LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION
- Publication number 20190339212
- Publication date Nov 7, 2019
- Intel Corporation
- Liang ZHANG
- G02 - OPTICS
Information Patent Application
REFLECTIVITY ANALYSIS TO DETERMINE MATERIAL ON A SURFACE
- Publication number 20190293558
- Publication date Sep 26, 2019
- Intel Corporation
- Jianyong MO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
2D METROLOGY TECHNIQUE FOR SOLDER PASTE INSPECTION
- Publication number 20190206038
- Publication date Jul 4, 2019
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION OF MICROELECTRONIC DEVICES USING NEAR-INFRARED LIGHT
- Publication number 20160363542
- Publication date Dec 15, 2016
- Intel Corporation
- Liang W. Zhang
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION OF MICROELECTRONIC DEVICES USING NEAR-INFRARED LIGHT
- Publication number 20150276621
- Publication date Oct 1, 2015
- Liang W. Zhang
- G01 - MEASURING TESTING
Information Patent Application
ALIGNMENT INSPECTION
- Publication number 20120135546
- Publication date May 31, 2012
- Zhihua Zou
- G06 - COMPUTING CALCULATING COUNTING

Liang William Zhang

Person

Patents Grantslast 30 patents

Apparatuses and methods for inspecting embedded features

Device, method and system for optical communication with a waveguid...

Non-destructive gap metrology

Method to achieve tilted patterning with a through resist thickness...

Apparatus for semiconductor package inspection

2D metrology technique for solder paste inspection

Reflectivity analysis to determine material on a surface

Inspection of microelectronic devices using near-infrared light

Inspection of microelectronic devices using near-infrared light

Alignment inspection

Patents Applicationslast 30 patents

TECHNOLOGIES FOR BEAM EXPANSION IN MONOLITHIC GLASS SUBSTRATES

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

INSPECTION TOOL AND INSPECTION METHOD

APPARATUSES AND METHODS FOR INSPECTING EMBEDDED FEATURES

NON-DESTRUCTIVE GAP METROLOGY

METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...

METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...

AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION

REFLECTIVITY ANALYSIS TO DETERMINE MATERIAL ON A SURFACE

2D METROLOGY TECHNIQUE FOR SOLDER PASTE INSPECTION

INSPECTION OF MICROELECTRONIC DEVICES USING NEAR-INFRARED LIGHT

INSPECTION OF MICROELECTRONIC DEVICES USING NEAR-INFRARED LIGHT

ALIGNMENT INSPECTION