Liang-Yueh Ou Yang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 10,985,061
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive fill
- Patent number 10,879,114
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures in integrated circuits
- Patent number 10,872,815
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,845
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures in integrated circuits
- Patent number 10,636,702
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,497,615
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 10,483,165
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle-mounted device and secure communication method
- Patent number 10,264,615
- Issue date Apr 16, 2019
- Hon Hai Precision Industry Co., Ltd.
- Liang-Yuan Ouyang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 10,186,456
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,157,785
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cap apparatus and method
- Patent number 9,786,604
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnect Structures in Integrated Circuits
- Publication number 20200258777
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnect Structures in Integrated Circuits
- Publication number 20200105593
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Contact Plugs with Reduced Corrosion
- Publication number 20200075407
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200043781
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Contact Plugs with Reduced Corrosion
- Publication number 20190115256
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20190109043
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180315647
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Contact Plugs with Reduced Corrosion
- Publication number 20180308751
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Cap Apparatus and Method
- Publication number 20160064332
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- H01 - BASIC ELECTRIC ELEMENTS

Liang-Yueh Ou Yang

Person

Patents Grantslast 30 patents

Methods for forming contact plugs with reduced corrosion

Conductive fill

Conductive interconnect structures in integrated circuits

Semiconductor device and method

Conductive interconnect structures in integrated circuits

Semiconductor device and method

Methods for forming contact plugs with reduced corrosion

Vehicle-mounted device and secure communication method

Methods for forming contact plugs with reduced corrosion

Semiconductor device and method

Metal cap apparatus and method

Patents Applicationslast 30 patents

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

Conductive Interconnect Structures in Integrated Circuits

Conductive Interconnect Structures in Integrated Circuits

Methods for Forming Contact Plugs with Reduced Corrosion

Semiconductor Device and Method

Methods for Forming Contact Plugs with Reduced Corrosion

Semiconductor Device and Method

Semiconductor Device and Method

Methods for Forming Contact Plugs with Reduced Corrosion

Metal Cap Apparatus and Method