Liang-Yueh Ou Yang

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of compensating for filling material losses in...
- Patent number 9,632,498
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yi Chang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electro chemical plating process
- Patent number 9,476,135
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yi Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal cap apparatus and method
- Patent number 9,209,073
- Issue date Dec 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Yueh Ou Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device-Level Interconnects for Stacked Transistor Structures and Me...
- Publication number 20240413211
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Contact Plugs with Reduced Corrosion
- Publication number 20210257254
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Cap Apparatus and Method
- Publication number 20140264920
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Yueh Ou Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF COMPENSATING FOR FILLING MATERIAL LOSSES IN...
- Publication number 20140277681
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro Chemical Plating Process
- Publication number 20140262797
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Yi Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR