Liangbiao CHEN

Person

Scarborough, ME, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,842,942
- Issue date Dec 12, 2023
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,830,784
- Issue date Nov 28, 2023
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer with pattern layout for dual side cooling power module
- Patent number 11,562,938
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,282,764
- Issue date Mar 22, 2022
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,121,055
- Issue date Sep 14, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 11,075,090
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE
- Publication number 20220208635
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20220208637
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20210398874
- Publication date Dec 23, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210320013
- Publication date Oct 14, 2021
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20210249329
- Publication date Aug 12, 2021
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20210217679
- Publication date Jul 15, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210134606
- Publication date May 6, 2021
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS

Liangbiao CHEN

Person

Patents Grantslast 30 patents

Leadframe spacer for double-sided power module

Semiconductor packages and related methods

Structure and method related to a power module using a hybrid spacer

Leadframe spacer for double-sided power module

Spacer with pattern layout for dual side cooling power module

Structure and method related to a power module using a hybrid spacer

Leadframe spacer for double-sided power module

Semiconductor packages and related methods

Patents Applicationslast 30 patents

PACKAGE WITH MOLDING CAVITY

SEMICONDUCTOR PACKAGES AND RELATED METHODS

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGES AND RELATED METHODS

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGES AND RELATED METHODS