Librado Gatbonton

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of packaging semiconductor devices
- Patent number 8,647,924
- Issue date Feb 11, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with patterned mask over thermal relief
- Patent number 8,274,145
- Issue date Sep 25, 2012
- Stats Chippac Ltd.
- Leocadio M. Alabin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20100261313
- Publication date Oct 14, 2010
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
- Publication number 20090236726
- Publication date Sep 24, 2009
- United Test & Assembly Center Ltd.
- Danny RETUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF
- Publication number 20090008768
- Publication date Jan 8, 2009
- Leocadio M. Alabin
- H01 - BASIC ELECTRIC ELEMENTS