Lidong SONG

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 12,137,567
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 11,991,880
- Issue date May 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,998,079
- Issue date May 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 10,930,663
- Issue date Feb 23, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 10,847,531
- Issue date Nov 24, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 10,804,287
- Issue date Oct 13, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,679,721
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 10,522,474
- Issue date Dec 31, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250017019
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20240292622
- Publication date Aug 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230070357
- Publication date Mar 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20210043643
- Publication date Feb 11, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20200411547
- Publication date Dec 31, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200265913
- Publication date Aug 20, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200203285
- Publication date Jun 25, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20190074291
- Publication date Mar 7, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190067314
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190057756
- Publication date Feb 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190051610
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Lidong SONG

Person

Patents Grantslast 30 patents

Interconnect structure of three-dimensional memory device

Three-dimensional memory devices and fabricating methods thereof

Structure and method for testing three-dimensional memory device

Interconnect structure of three-dimensional memory device

Interconnect structure of three-dimensional memory device

Three-dimensional memory devices and fabricating methods thereof

Structure and method for testing three-dimensional memory device

Staircase etch control in forming three-dimensional memory device

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE