Lidong Zhang

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame with selective patterned plating
- Patent number 10,847,449
- Issue date Nov 24, 2020
- NXP USA, INC.
- Meijiang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead frame for semiconductor die package with improved creep...
- Patent number 10,734,311
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...
- Publication number 20200203262
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH SELECTIVE PATTERNED PLATING
- Publication number 20200203258
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Meijiang Song
- H01 - BASIC ELECTRIC ELEMENTS