Liguang Du

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Package protector with integrated guide pin
- Patent number 11,201,420
- Issue date Dec 14, 2021
- Intel Corporation
- Jun Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation using airflow diversion with cooling fins
- Patent number 11,106,256
- Issue date Aug 31, 2021
- Intel Corporation
- Tao Shu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Ground heat sink for dual inline memory module cooling
- Patent number 10,873,145
- Issue date Dec 22, 2020
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
- Publication number 20230420338
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS
- Publication number 20230309262
- Publication date Sep 28, 2023
- Intel Corporation
- Liguang DU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
- Publication number 20220200177
- Publication date Jun 23, 2022
- Intel Corporation
- Jun LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESILIENT ELECTRICAL CONNECTORS FOR ELECTROMAGNETIC INTERFERENCE SH...
- Publication number 20220139843
- Publication date May 5, 2022
- Intel Corporation
- Jun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
- Publication number 20210143566
- Publication date May 13, 2021
- Intel Corporation
- Jun LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION USING AIRFLOW DIVERSION WITH COOLING FINS
- Publication number 20200218317
- Publication date Jul 9, 2020
- Intel Corporation
- Tao SHU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
GROUND HEAT SINK FOR DUAL INLINE MEMORY MODULE COOLING
- Publication number 20190319385
- Publication date Oct 17, 2019
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package protector with integrated guide pin

Heat dissipation using airflow diversion with cooling fins

Ground heat sink for dual inline memory module cooling

Patents Applicationslast 30 patents

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...

IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS

PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN

RESILIENT ELECTRICAL CONNECTORS FOR ELECTROMAGNETIC INTERFERENCE SH...

PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN

HEAT DISSIPATION USING AIRFLOW DIVERSION WITH COOLING FINS

GROUND HEAT SINK FOR DUAL INLINE MEMORY MODULE COOLING