Lih-Juann Chen

Person

Miaoli Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Strained silicon forming method with reduction of threading disloca...
- Patent number 7,498,224
- Issue date Mar 3, 2009
- Industrial Technology Research Institute
- Pang-Shiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of thin strain-relaxed SiGe layers and method for fabr...
- Patent number 7,202,512
- Issue date Apr 10, 2007
- Industrial Technology Research Institute
- Pang-Shiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained silicon forming method with reduction of threading disloca...
- Patent number 7,102,153
- Issue date Sep 5, 2006
- Industrial Technology Research Institute
- Pang-Shiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanizing solution for the galvanic deposition of copper
- Patent number 6,858,123
- Issue date Feb 22, 2005
- Merck Patent Gesellschaft mit beschrankter Haftung
- Jung-Chih Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for improving the moisture absorption of porous low dielectr...
- Patent number 6,417,118
- Issue date Jul 9, 2002
- United Microelectronics Corp.
- Jung-Chih Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing phase transition temperature by using silicon-ge...
- Patent number 6,399,487
- Issue date Jun 4, 2002
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion prom...
- Patent number 6,083,829
- Issue date Jul 4, 2000
- Taiwan Semiconductor Manufacturing Company
- Jane-Bai Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating contact plug
- Patent number 6,043,148
- Issue date Mar 28, 2000
- United Microelectronics Corp.
- Yuan-Ching Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing cobalt silicide layer
- Patent number 6,022,457
- Issue date Feb 8, 2000
- United Microelectronics Corp.
- Hsin-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve adhesion between copper and titanium nitride, for...
- Patent number 6,015,749
- Issue date Jan 18, 2000
- Taiwan Semiconductor Manufacturing Company
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor components having a titanium...
- Patent number 5,897,373
- Issue date Apr 27, 1999
- United Microelectronics Corp.
- Yuan-Ching Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Strained silicon forming method with reduction of threading disloca...
- Publication number 20060255331
- Publication date Nov 16, 2006
- Industrial Technology Research Institute
- Pang-Shiu Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
Construction of thin strain-relaxed SiGe layers and method for fabr...
- Publication number 20050179028
- Publication date Aug 18, 2005
- Pang-Shiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strained silicon forming method with reduction of threading disloca...
- Publication number 20050045870
- Publication date Mar 3, 2005
- Industrial Technology Research Institute
- Pang Shiu Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of forming low-temperature polysilicon
- Publication number 20030045038
- Publication date Mar 6, 2003
- Hsin-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS

Lih-Juann Chen

Person

Patents Grantslast 30 patents

Strained silicon forming method with reduction of threading disloca...

Construction of thin strain-relaxed SiGe layers and method for fabr...

Strained silicon forming method with reduction of threading disloca...

Galvanizing solution for the galvanic deposition of copper

Method for improving the moisture absorption of porous low dielectr...

Method of reducing phase transition temperature by using silicon-ge...

Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion prom...

Method of fabricating contact plug

Method of manufacturing cobalt silicide layer

Method to improve adhesion between copper and titanium nitride, for...

Method of manufacturing semiconductor components having a titanium...

Patents Applicationslast 30 patents

Strained silicon forming method with reduction of threading disloca...

Construction of thin strain-relaxed SiGe layers and method for fabr...

Strained silicon forming method with reduction of threading disloca...

Method of forming low-temperature polysilicon