LIH-MING DOONG

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ZHUNAN TOWNSHIP, TW

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Patents Grantslast 30 patents

Information Patent Grant
Isolated coupling structure
- Patent number 11,170,926
- Issue date Nov 9, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Jung-Pei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure with heat dissipation enhancement and i...
- Patent number 8,659,128
- Issue date Feb 25, 2014
- Richtek Technology Corp.
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATED COUPLING STRUCTURE
- Publication number 20190172621
- Publication date Jun 6, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Jung-Pei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE WITH HEAT DISSIPATION ENHANCEMENT AND I...
- Publication number 20110221047
- Publication date Sep 15, 2011
- RICHTEK TECHNOLOGY CORP.
- YU-LIN YANG
- H01 - BASIC ELECTRIC ELEMENTS