Lih-Shyng Tsai

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method and resulting device for field inversion free multiple layer...
- Patent number 5,461,254
- Issue date Oct 24, 1995
- Taiwan Semiconductor Manufacturing Company LTD.
- Lih-Shyng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment to prevent field device leakage in VLSI p...
- Patent number 5,334,554
- Issue date Aug 2, 1994
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kwang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified and robust self-aligning contact process
- Patent number 5,286,667
- Issue date Feb 15, 1994
- Taiwan Semiconductor Manufacturing Company
- Jiunn-Jyi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for field inversion free multiple layer metallurgy VLSI proc...
- Patent number 5,252,515
- Issue date Oct 12, 1993
- Taiwan Semiconductor Manufacturing Company
- Lih-Shyng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid thermal treatment to eliminate metal void formation in VLSI m...
- Patent number 5,248,384
- Issue date Sep 28, 1993
- Taiwan Semiconductor Manufacturing Company
- Kwang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS