Lihua Li Huang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a low-K dual damascene interconnect structure
- Patent number 7,435,685
- Issue date Oct 14, 2008
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature process to produce low-K dielectrics with low stres...
- Patent number 7,422,776
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Mixing Energized and Non-Energized Gases for Silicon Nitride Deposi...
- Publication number 20120009803
- Publication date Jan 12, 2012
- Applied Materials, Inc.
- Kee Bum Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING A LOW-K DUAL DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20080145998
- Publication date Jun 19, 2008
- Applied Materials, Inc.
- GERARDO A. DELGADINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion improvement for low k dielectrics
- Publication number 20060189162
- Publication date Aug 24, 2006
- APPLIED MATERIALS, INC.
- Lihua Li Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Mixing energized and non-energized gases for silicon nitride deposi...
- Publication number 20060162661
- Publication date Jul 27, 2006
- APPLIED MATERIALS, INC.
- Kee Bum Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tensile and compressive stressed materials for semiconductors
- Publication number 20060105106
- Publication date May 18, 2006
- APPLIED MATERIALS, INC.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low temperature process to produce low-K dielectrics with low stres...
- Publication number 20060043591
- Publication date Mar 2, 2006
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion improvement for low k dielectrics
- Publication number 20050202685
- Publication date Sep 15, 2005
- APPLIED MATERIALS, INC.
- Lihua Li Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming a low-K dual damascene interconnect structure
- Publication number 20040157453
- Publication date Aug 12, 2004
- APPLIED MATERIALS, INC.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS

Lihua Li Huang

Person

Patents Grantslast 30 patents

Method of forming a low-K dual damascene interconnect structure

Low temperature process to produce low-K dielectrics with low stres...

Patents Applicationslast 30 patents

Mixing Energized and Non-Energized Gases for Silicon Nitride Deposi...

METHOD OF FORMING A LOW-K DUAL DAMASCENE INTERCONNECT STRUCTURE

Adhesion improvement for low k dielectrics

Mixing energized and non-energized gases for silicon nitride deposi...

Tensile and compressive stressed materials for semiconductors

Low temperature process to produce low-K dielectrics with low stres...

Adhesion improvement for low k dielectrics

Method of forming a low-K dual damascene interconnect structure