TREA

Lihui Lu

Follow

Person

  • Shanghai, CN
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer dicing method
    • Patent number 10,658,239
    • Issue date May 19, 2020
    • Semiconductor Manufacturing International (Beijing) Corp.
    • Lihui Lu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER DICING METHOD
    • Publication number 20190181045
    • Publication date Jun 13, 2019
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Lihui Lu
    • H01 - BASIC ELECTRIC ELEMENTS