Lik Huay Lim

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Test system and method of testing a wafer for integrated circuit de...
- Patent number 10,823,759
- Issue date Nov 3, 2020
- Xilinx, Inc.
- Lik Huay Lim
- G01 - MEASURING TESTING
Information Patent Grant
Probe head securing mechanism for probe assembly
- Patent number 10,613,137
- Issue date Apr 7, 2020
- Xilinx, Inc.
- Mohsen H. Mardi
- G01 - MEASURING TESTING
Information Patent Grant
Probe head assembly
- Patent number 10,571,517
- Issue date Feb 25, 2020
- Xilinx, Inc.
- Mohsen H. Mardi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TEST SYSTEM AND METHOD OF TESTING A WAFER FOR INTEGRATED CIRCUIT DE...
- Publication number 20200141976
- Publication date May 7, 2020
- Xilinx, Inc.
- Lik Huay Lim
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD SECURING MECHANISM FOR PROBE ASSEMBLY
- Publication number 20190170816
- Publication date Jun 6, 2019
- Xilinx, Inc.
- Mohsen H. Mardi
- G01 - MEASURING TESTING