Lilia May

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density organic interconnect structures
- Patent number 12,062,551
- Issue date Aug 13, 2024
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic interconnect structures
- Patent number 11,631,595
- Issue date Apr 18, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with embedded fine line space in a cavity, and a method f...
- Patent number 11,272,619
- Issue date Mar 8, 2022
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density organic interconnect structures
- Patent number 11,195,727
- Issue date Dec 7, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo-stripline using double solder-resist structure
- Patent number 11,107,780
- Issue date Aug 31, 2021
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having polymer-derived ceramic core
- Patent number 11,075,130
- Issue date Jul 27, 2021
- Intel Corporation
- Lisa Ying Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic interconnect structures
- Patent number 10,685,850
- Issue date Jun 16, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20240355641
- Publication date Oct 24, 2024
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE
- Publication number 20240329333
- Publication date Oct 3, 2024
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
- Publication number 20240111090
- Publication date Apr 4, 2024
- Intel Corporation
- Robert A. May
- G02 - OPTICS
Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20230223278
- Publication date Jul 13, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD F...
- Publication number 20220183157
- Publication date Jun 9, 2022
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20220059367
- Publication date Feb 24, 2022
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHO...
- Publication number 20210307172
- Publication date Sep 30, 2021
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PSEUDO-STRIPLINE USING DOUBLE SOLDER-RESIST STRUCTURE
- Publication number 20200388582
- Publication date Dec 10, 2020
- Intel Corporation
- Lilia May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20200312675
- Publication date Oct 1, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED HEAT PIPE
- Publication number 20200176355
- Publication date Jun 4, 2020
- Intel Corporation
- Robert A. May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE
- Publication number 20190393109
- Publication date Dec 26, 2019
- Intel Corporation
- Lisa Ying Ying CHEN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

High density organic interconnect structures

High density organic interconnect structures

Apparatus with embedded fine line space in a cavity, and a method f...

High density organic interconnect structures

Pseudo-stripline using double solder-resist structure

Package substrate having polymer-derived ceramic core

High density organic interconnect structures

Methods of forming joint structures for surface mount packages

Package structure to enhance yield of TMI interconnections

Package structure to enhance yield of TMI interconnections

Patents Applicationslast 30 patents

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

DIRECTLY COUPLED OPTICAL INTERPOSER

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD F...

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

AN APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHO...

PSEUDO-STRIPLINE USING DOUBLE SOLDER-RESIST STRUCTURE

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

SUBSTRATE EMBEDDED HEAT PIPE

PACKAGE SUBSTRATE HAVING POLYMER-DERIVED CERAMIC CORE

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

Package Structure To Enhance Yield of TMI Interconnections

Package Structure To Enhance Yield of TMI Interconnections