Lillian C. Thompson

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building vertical pillar interconnect
- Patent number 9,627,254
- Issue date Apr 18, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly including an antenna element embedded with...
- Patent number 6,049,463
- Issue date Apr 11, 2000
- Motorola, Inc.
- Grace M. O'Malley
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS
- Publication number 20160268223
- Publication date Sep 15, 2016
- Flipchip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS