Lily Khor

Person

  • Ipoh, MY

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MOLDED INTEGRATED CIRCUIT PACKAGES

    • Publication number 20200219800
    • Publication date Jul 9, 2020
    • Carsem (M) SDN. BHD.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

    • Publication number 20180211902
    • Publication date Jul 26, 2018
    • Carsem (M) Sdn.Bhd.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW-PROFILE ELECTRONIC PACKAGE

    • Publication number 20180150673
    • Publication date May 31, 2018
    • Carsem (M) Sdn.Bhd.
    • Yan Shan Ng
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    STACKED ELECTRONIC PACKAGES

    • Publication number 20150237721
    • Publication date Aug 20, 2015
    • Carsem (M) SDN. BHD.
    • Thong Kai Choh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

    • Publication number 20150179553
    • Publication date Jun 25, 2015
    • Carsem (M) Sdn.Bhd.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COLOR YIELD OF WHITE LEDS

    • Publication number 20150087087
    • Publication date Mar 26, 2015
    • CARSEM (M) SDN. BHD.
    • Edmund Sales Cabatbat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

    • Publication number 20120043655
    • Publication date Feb 23, 2012
    • CARSEM (M) SDN. BHD.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

    • Publication number 20100102444
    • Publication date Apr 29, 2010
    • CARSEM (M) SDN. BHD.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of manufacturing a cavity package

    • Publication number 20060148127
    • Publication date Jul 6, 2006
    • Carsem Semiconductor Sdn. Bhd.
    • King Hoo Ong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Flip chip on lead frame

    • Publication number 20050037545
    • Publication date Feb 17, 2005
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS