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Lily Khor
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Ipoh, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Molded integrated circuit packages and methods of forming the same
Patent number
11,114,367
Issue date
Sep 7, 2021
Carsem (M) Sdn. Bhd.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-profile electronic package
Patent number
10,468,319
Issue date
Nov 5, 2019
Carsem (M) Sdn. Bhd.
Yan Shan Ng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Pre-molded integrated circuit packages
Patent number
9,935,039
Issue date
Apr 3, 2018
Carsem (M) Sdn. Bhd.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked electronic packages
Patent number
9,640,517
Issue date
May 2, 2017
Carsem (M) Sdn. Bhd.
Thong Kai Choh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Color yield of white LEDs
Patent number
9,048,397
Issue date
Jun 2, 2015
Carsem (M) Sdn. Bhd.
Edmund Sales Cabatbat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package using stud bump coated with solder
Patent number
8,071,470
Issue date
Dec 6, 2011
Carsem (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a cavity package
Patent number
7,273,767
Issue date
Sep 25, 2007
Carsem (M) Sdn. Bhd.
King Hoo Ong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Flip chip on lead frame
Patent number
6,953,711
Issue date
Oct 11, 2005
Carsem (M) Sdn. Bhd.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip on lead frame
Patent number
6,482,680
Issue date
Nov 19, 2002
Carsem Semiconductor SDN, BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MOLDED INTEGRATED CIRCUIT PACKAGES
Publication number
20200219800
Publication date
Jul 9, 2020
Carsem (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
Publication number
20180211902
Publication date
Jul 26, 2018
Carsem (M) Sdn.Bhd.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-PROFILE ELECTRONIC PACKAGE
Publication number
20180150673
Publication date
May 31, 2018
Carsem (M) Sdn.Bhd.
Yan Shan Ng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STACKED ELECTRONIC PACKAGES
Publication number
20150237721
Publication date
Aug 20, 2015
Carsem (M) SDN. BHD.
Thong Kai Choh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
Publication number
20150179553
Publication date
Jun 25, 2015
Carsem (M) Sdn.Bhd.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COLOR YIELD OF WHITE LEDS
Publication number
20150087087
Publication date
Mar 26, 2015
CARSEM (M) SDN. BHD.
Edmund Sales Cabatbat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
Publication number
20120043655
Publication date
Feb 23, 2012
CARSEM (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
Publication number
20100102444
Publication date
Apr 29, 2010
CARSEM (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a cavity package
Publication number
20060148127
Publication date
Jul 6, 2006
Carsem Semiconductor Sdn. Bhd.
King Hoo Ong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Flip chip on lead frame
Publication number
20050037545
Publication date
Feb 17, 2005
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS