Lily Zhao

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
- Patent number 8,847,391
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging an integrated circuit and methods of forming a...
- Patent number RE42457
- Issue date Jun 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lily Zhao
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Integrated circuit package, ball-grid array integrated circuit package
- Patent number RE42332
- Issue date May 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lily Zhao
- 257 - Active solid-state devices
Information Patent Grant
Integrated circuit package, ball-grid array integrated circuit package
- Patent number 6,630,737
- Issue date Oct 7, 2003
- Koninklijke Philips Electronics N.V.
- Lily Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of packaging an integrated circuit and methods of forming a...
- Patent number 6,207,476
- Issue date Mar 27, 2001
- VLSI Technology, Inc.
- Lily Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE
- Publication number 20240371806
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...
- Publication number 20230369230
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...
- Publication number 20230369234
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...
- Publication number 20230299048
- Publication date Sep 21, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES
- Publication number 20220320026
- Publication date Oct 6, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION FLIP CHIP BUMP
- Publication number 20210210449
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...
- Publication number 20180331061
- Publication date Nov 15, 2018
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
- Publication number 20140008788
- Publication date Jan 9, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified Pillar Design for Improved Flip Chip Packaging
- Publication number 20100300743
- Publication date Dec 2, 2010
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Increasing a Routing Density For a Circuit Board and Suc...
- Publication number 20080251286
- Publication date Oct 16, 2008
- Koninklijke Philips Electronics N.V.
- Lily Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE, BALL-GRID ARRAY INTEGRATED CIRCUIT PACK...
- Publication number 20010015497
- Publication date Aug 23, 2001
- LILY ZHAO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal compression flip chip bump for high performance and fine pitch

Package comprising spacers between integrated devices

Sidewall wetting barrier for conductive pillars

Flip-chip flexible under bump metallization size

Non-circular under bump metallization (UBM) structure, orientation...

Methods of packaging an integrated circuit and methods of forming a...

Integrated circuit package, ball-grid array integrated circuit package

Integrated circuit package, ball-grid array integrated circuit package

Methods of packaging an integrated circuit and methods of forming a...

Patents Applicationslast 30 patents

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...

PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

THERMAL COMPRESSION FLIP CHIP BUMP

INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...

Modified Pillar Design for Improved Flip Chip Packaging

Method For Increasing a Routing Density For a Circuit Board and Suc...

INTEGRATED CIRCUIT PACKAGE, BALL-GRID ARRAY INTEGRATED CIRCUIT PACK...