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Lim Guek Har
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Sinagapore, SG
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last 30 patents
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Patent Grant
Method and apparatus for cutting semiconductor wafers
Patent number
7,018,270
Issue date
Mar 28, 2006
Micron Technology, Inc.
Neo Chee Peng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for cutting semiconductor wafers
Patent number
6,939,199
Issue date
Sep 6, 2005
Micron Technology, Inc.
Neo Chee Peng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR