Lim Jin Keong

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Kuala Lumpur, MY

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20140291822
- Publication date Oct 2, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lim Jin Keong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE MOLDING
- Publication number 20130140737
- Publication date Jun 6, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Lim Jin Keong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL