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Lim Peng Soon
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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus and method for miniature semiconductor packages
Patent number
7,419,855
Issue date
Sep 2, 2008
National Semiconductor Corporation
Shaw Wei Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress relieving film for semiconductor packages
Patent number
7,187,075
Issue date
Mar 6, 2007
National Semiconductor Corporation
Tan Eng Hwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for miniature semiconductor packages
Patent number
7,161,232
Issue date
Jan 9, 2007
National Semiconductor Corporation
Shaw Wei Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-low loop wire bonding
Patent number
6,933,223
Issue date
Aug 23, 2005
National Semiconductor Corporation
Lim Peng Soon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
SAWN POWER PACKAGE AND METHOD OF FABRICATING SAME
Publication number
20080096319
Publication date
Apr 24, 2008
National Semiconductor Corporation
Tan Eng Hwa
H01 - BASIC ELECTRIC ELEMENTS