Lin Bo SHI

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES
- Publication number 20180269178
- Publication date Sep 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang CHENG
- H01 - BASIC ELECTRIC ELEMENTS