Lin Chien-Tsun

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wafer level chip size package
- Patent number 6,521,485
- Issue date Feb 18, 2003
- Walsin Advanced Electronics Ltd.
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN semiconductor package
- Patent number 6,459,148
- Issue date Oct 1, 2002
- Walsin Advanced Electronics LTD
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable QFN semiconductor package
- Patent number 6,337,510
- Issue date Jan 8, 2002
- Walsin Advanced Electronics Ltd.
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package for fixed surface mounting
- Publication number 20030006055
- Publication date Jan 9, 2003
- Walsin Advanced Electronics LTD
- Lai Chien-Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for underfilling bonding gap between flip-chip and circuit s...
- Publication number 20020173074
- Publication date Nov 21, 2002
- Walsin Advanced Electronics LTD
- Su Chun-Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing wafer level chip size package
- Publication number 20020094601
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing chip size package and its structure
- Publication number 20020094683
- Publication date Jul 18, 2002
- Walsin Advanced Electronics LTD
- Spencer Su
- H01 - BASIC ELECTRIC ELEMENTS