Lin Cui

Follow

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Eliminating first wafer metal contamination effect in high density...
- Patent number 10,023,956
- Issue date Jul 17, 2018
- Lam Research Corporation
- Lin Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Edge roughness reduction
- Patent number 10,020,183
- Issue date Jul 10, 2018
- Lam Research Corporation
- Yansha Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching in continuous plasma
- Patent number 9,991,128
- Issue date Jun 5, 2018
- Lam Research Corporation
- Zhongkui Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCHING IN CONTINUOUS PLASMA
- Publication number 20170229311
- Publication date Aug 10, 2017
- LAM RESEARCH CORPORATION
- Zhongkui Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELIMINATING FIRST WAFER METAL CONTAMINATION EFFECT IN HIGH DENSITY...
- Publication number 20160300713
- Publication date Oct 13, 2016
- LAM RESEARCH CORPORATION
- Lin Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...