Lin HOU

Person

Leuven, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly with metal alloy bonding pads and...
- Patent number 11,646,282
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing low dielectric constant bonding dielectr...
- Patent number 11,646,283
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly formed by hybrid wafer bonding using selectively de...
- Patent number 11,424,215
- Issue date Aug 23, 2022
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial tilt-resistant bonded assembly and methods for forming...
- Patent number 11,348,901
- Issue date May 31, 2022
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361066
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...
- Publication number 20230042438
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...
- Publication number 20230008286
- Publication date Jan 12, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY WITH METAL ALLOY BONDING PADS AND...
- Publication number 20220246562
- Publication date Aug 4, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING...
- Publication number 20220173071
- Publication date Jun 2, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY FORMED BY HYBRID WAFER BONDING USING SELECTIVELY DE...
- Publication number 20220149002
- Publication date May 12, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220093555
- Publication date Mar 24, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...
- Publication number 20210327838
- Publication date Oct 21, 2021
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING BONDING PADS SPACED APART BY POLYMER MAT...
- Publication number 20210320075
- Publication date Oct 14, 2021
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Bonded assembly containing different size opposing bonding pads and...

Bonded assembly including an airgap containing bonding-level dielec...

Bonded assembly including inter-die via structures and methods for...

Bonded semiconductor die assembly with metal alloy bonding pads and...

Bonded assembly containing low dielectric constant bonding dielectr...

Bonded assembly employing metal-semiconductor bonding and metal-met...

Bonded assembly formed by hybrid wafer bonding using selectively de...

Interfacial tilt-resistant bonded assembly and methods for forming...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR...

BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

BONDED SEMICONDUCTOR DIE ASSEMBLY WITH METAL ALLOY BONDING PADS AND...

INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING...

BONDED ASSEMBLY FORMED BY HYBRID WAFER BONDING USING SELECTIVELY DE...

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...

BONDED ASSEMBLY CONTAINING BONDING PADS SPACED APART BY POLYMER MAT...